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​​Customized SiC Ceramic Suction Cups for Lithography Applications​​

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​​Customized SiC Ceramic Suction Cups for Lithography Applications​​

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Brand Name : ZMSH

Model Number : SiC Ceramic Suction Cups

Certification : rohs

Place of Origin : CHINA

MOQ : 3

Price : by case

Payment Terms : T/T

Delivery Time : 2-4 weeks

Packaging Details : package in 100-grade cleaning room

Density : 3.1 g/cm³

Elastic Modulus : 410 GPa

Coefficient of Thermal Expansion : 4.6×10⁻⁶/K

Thermal Conductivity : 170 W/m·K

Flatness : ≤ 0.5 μm

Resistivity : 10^6 Ω·cm

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​​SiC Ceramic Suction Cups Abstract

​​Customized SiC Ceramic Suction Cups for Lithography Applications​​

As a core component of the ​​wafer stage​​ in lithography machines, the ​​silicon carbide (SiC) SiC Ceramic Suction Cups provides an ​​extremely stable and thermally insensitive reference platform​​ for wafers, owing to its ​​ultra-high flatness, high stiffness, and low coefficient of thermal expansion​​. This is critical for achieving ​​nanometer-level motion accuracy and repeatable positioning​​. Its internal ​​precision micro-channel structure​​ enables ​​uniform and stable adsorption of the wafer​​ via vacuum negative pressure, ​​avoiding damage or micro-deformation​​ caused by traditional mechanical clamping. Simultaneously, the ​​excellent thermal conductivity​​ of silicon carbide facilitates rapid equilibration of the wafer surface temperature, ​​reducing thermal gradient-induced deformation​​, thereby ensuring ​​line width uniformity and overlay accuracy​​. Furthermore, the inherent properties of the SiC Ceramic Suction Cups—​​being dust-free, wear-resistant, and chemically inert​​—allow it to meet the stringent requirements of ​​Class 100 and above​​ cleanroom environments, ​​significantly minimizing​​ the risk of wafer defects caused by particle contamination


SiC Ceramic Suction Cups Data

Parameter Category​​

​​Parameter Name​​

​​Typical Value/Range​​

​​Physical Properties​​

Density

3.1 g/cm³

Elastic Modulus

410 GPa

Bending Strength

500 MPa

​​Thermal Properties​​

Coefficient of Thermal Expansion

4.6×10⁻⁶/K

Thermal Conductivity

170 W/m·K

Maximum Operating Temperature

>1600°C

​​Surface Properties​​

Flatness

≤ 0.5 μm

Surface Roughness (Ra)

< 0.1 μm

​​Adsorption-Related​​

Pore Size (Porous Type)

5 - 50 μm

​​Electrical Properties​​

Resistivity

10^6 Ω·cm


SiC Ceramic Suction Cups Characteristic

​​Customized SiC Ceramic Suction Cups for Lithography Applications​​

1. ​​Ultra-High Precision & Mirror Polishing​​:

  • SiC ceramic suction cups achieve a ​​flatness within 0.3–0.5 μm​​ through precision grinding and polishing, with surfaces capable of ​​mirror-level polishing (surface roughness Ra < 0.1 μm)​​ .

​​2. Ultra-Lightweight Design​​:

  • Through ​​lightweight structural designs (e.g., hollow or honeycomb configurations)​​, SiC ceramic suction cups significantly reduce mass ​​while maintaining high stiffness​​ .

3. Exceptional Wear Resistance & High Stiffness​​:

  • Silicon carbide ceramic boasts ​​extreme hardness (Mohs hardness 9.5, second only to diamond) and outstanding wear resistance​​, ensuring long service life. Coupled with ​​high stiffness (elastic modulus up to 410 GPa)​​, it effectively resists deformation, maintaining stability under high-speed motion and heavy loads.

4. ​​Low Thermal Expansion​​:

  • The SiC ceramic suction cups exhibits a ​​low coefficient of thermal expansion (≈4.5–4.7×10⁻⁶/K)​​, making it highly insensitive to temperature fluctuations and resistant to thermal deformation.


Application of SiC Ceramic Suction Cups in Lithography Machines​

​​Customized SiC Ceramic Suction Cups for Lithography Applications​​

1.Ultra-High Precision Wafer Carrying and Positioning​​: Leveraging its ​​exceptional flatness (achieving 0.3–0.5 μm), high stiffness, and low coefficient of thermal expansion​​, the SiC ceramic suction cups provides an ​​extremely stable, flat, and thermally resilient reference platform​​ for the wafer.

2. ​​Vacuum Adsorption and Stable Clamping​​: Through its ​​precise micro-channel structure​​, the SiC ceramic suction cup applies vacuum pressure to ​​uniformly and securely adsorb the wafer​​, preventing any displacement or vibration during high-speed motion.

3. ​​Thermal Management Stability​​: The ​​high thermal conductivity​​ of silicon carbide facilitates rapid equilibration of the wafer surface temperature, ​​reducing thermal gradient-induced expansion differences​​, thereby ​​effectively suppressing wafer thermal distortion​​.

4. ​​Meeting Stringent Cleanroom Requirements​​: The SiC ceramic suction cups ​​generates no particulate debris, is wear-resistant, has low outgassing, and resists chemical corrosion​​, enabling it to meet the operational demands of lithography machines in ​​Class 100 or higher cleanroom environments​​.

​​Customized SiC Ceramic Suction Cups for Lithography Applications​​

Lithography machine worktable


ZMSH SiC Ceramic Custom Parts

​​Customized SiC Ceramic Suction Cups for Lithography Applications​​

Please feel free to contact us if you have any customization requirements.


SiC Ceramic Suction Cups FAQ

Q1: What are silicon carbide (SiC) ceramic suction cups primarily used for?​​

​​A1:​​ They are ​​critical for high-precision handling and transport of wafers and sensitive substrates​​ in semiconductor manufacturing, photovoltaics, and precision optics, ensuring contamination-free and stable adsorption under extreme conditions (e.g., high temperature, high vacuum).

​​Q2: Why choose silicon carbide over other materials for suction cups?​​

​​A2:​​ Silicon carbide offers ​​exceptional hardness (Mohs 9.5), high thermal stability (resists temperatures >1600°C), low thermal expansion, and superior chemical inertness​​, making it ideal for applications demanding ultra-cleanliness, wear resistance, and dimensional stability under thermal stress.


Tags: #SiC Ceramic Suction Cups, #Customized, #Lithography Applications

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